RELIFE Tin Soldering Paste Sn63 Pb67 183 Degree Medium Temperature No-Clean Flux Rosin For BGA PCB SMT Reballing Welding Repair
6.52$
6.52$
Quantity:
1
Availability:
Color
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Features:
1.Viscous and smooth
2.Solder wicking is strong
3.Less residual
4.No clean
5.Paste delicate,Lasting shine,The particle size is only 20-38 micron.
6. solder paste up to 79%
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RELIFE Tin Soldering Paste Sn63 Pb67 183 Degree Medium Temperature No-Clean Flux Rosin For BGA PCB SMT Reballing Welding Repair
6.52$
6.52$
Quantity:
1
Availability:
Color
