Mijing Quick Release Kinfe KC8 Motherboard IC Remove Glue Rework Blade CPU Disassemble Knife Chip Repair Scraper Pry Knife Kit

Mijing KC8 Glue Removal Blade Set for Mobile Phone Motherboard Maintenance CPU Disassemble Knife Hand Tool
Description
Mijing KC8 multi-function Quick Release Knife for Mobile Phone Motherboard Glue Removal. MIJING KC8 Maintenance Knife Handle Blade Set IC Remove Glue Rework Blade CPU Disassemble Knife,Supports quick replacement blades.
Features
Press the rebound structure, quickly remove the blade.
Multi-functional glue removal knife, high-temperature resistance, corrosion resistance, high hardness, high toughness, fine high carbon elastic steel, pure hand polished.
A variety of options to provide you with solutions to all kinds of maintenance problems, cutting black glue, side glue removal, motherboard glue removal, prying hard disk, etc.
Pure hand polishing, surface vacuum plating process, with strong corrosion resistance and high-temperature durability, and wear resistance.
New blade design, rigid and flexible, with strength, more toughness
Fine high-carbon elastic steel blade grinding, toughness, rebound does not deform.
Comfortable grip, with a universal ergonomic knife handle.
Each piece of blade material is laser cut to ensure a high degree of product uniformity.
Package List
KC8:
1 x Handle
8 x Blades
VC965:
10pcs #11 blades 10pcs #23 with 2 handle