LCD Anisotropic Conductive ACF Film: AC-7206U-18 AC7206U-18 New Datecode

ACF AC-7206U-18 TAPE For LCD Screen Repair 1.2/1.5/2.0mm*10m/25m/50m Original LCD Anisotropic Conductive ACF Film

1. For unopened ACF, storage conditions:-10~5, and its service life is six months after manufacture (the date of manufacture and the trademark of valid ACF under storage conditions will be indicated).
2. Preservation conditions of the unsealed products:-10~5 be sure to seal it with a bag and put it in the refrigerator for preservation. Thaw for 30 minutes before use before unpacking.; If the unopened product is stored in high temperature environment, its effective service life will be shortened.
3. Accelerate the thermal curing of ACF; If the expired products exceed the guarantee period of use, our company stipulates that the non-opened ACF shall not be used for more than one year from the factory, and shall be scrapped for more than one year, the opened ACF is directly scrapped.
According to the requirement of fine spacing, ACF with Double Layer structure is proposed, and the upper Layer of Double Layer structure is resin Layer without conductive particles, while the lower layer is the arrangement containing single layer conductive particles. Compared with ACF of traditional single-layer structure, double-layer structure can have higher density of local particles in the lower layer without increasing the density of conductive particles, it makes the particle density in the contact area of the electrode unit higher, and at the same time, when it is close to the convex area of the chip, the situation of short circuit is reduced due to the low density of local particles.
In terms of resin adhesive, for the sake of reliability, Hitachi Chemical has chosen to use epoxy resin system in its products, which has improved the adhesive strength of materials, glass transfer temperature, moisture resistance and other characteristics.
1. Heteromorphic Conductive Film;ACF) ACF2.1 what is heteromorphic Conductive adhesive: its characteristic is that the electrical conduction direction of Z axis has obvious difference with the resistance characteristics of XY insulation plane. When the difference between the conduction resistance value of z axis and XY plane insulation resistance value exceeds a certain ratio, it can be called good conductive heteroscedasticity.
2. Conduction principle: the conductive particles are used to connect the electrodes between the IC chip and the substrate to make them conductive, and at the same time, the conduction short circuit between the adjacent two electrodes can be avoided, thus achieving the purpose of conduction only in the z axis direction.
3. Product classification:
(1) heteromorphic conductive paste.
(2) heteromorphic conductive film. Heteromorphic conductive film (ACF) has the characteristic of extremely low material loss that can be continuously processed (Tape-on-Reel), so it has become a commonly used product form at present.
4. Main components: mainly including resin adhesive and conductive particles. The function of resin adhesive is mainly to fix the relative position of electrode between IC chip and substrate, besides moisture-proof gas, heat resistance and insulation, and provide a pressure force to maintain the contact area between the electrode and the conductive particle. General resin is divided into two categories: Thermoplastic resin and thermoset resin. Thermoplastic material mainly has the advantages of low temperature, quick assembly and easy heavy work, but it also has the disadvantages of high thermal expansion and high hygroscopicity, which makes it easy to deteriorate under high temperature and cannot meet the requirements of reliability and trustworthiness. However, thermoset resin, such as Epoxy resin, Polyimide, etc., have the advantages of high temperature stability, low thermal expansion and hygroscopicity, but its disadvantages are high processing temperature and difficulty in reworking, but its advantage of high reliability is still the most widely used material at present.
5. Bonding process: Normally, the conductive particles are evenly distributed in the binder and do not contact each other. In addition, there is a layer of insulating film, and the ACF film is non-conductive. When the ACF film is pressurized and heated (generally pressurized, heating two times for the first time as a temporary affixed to products in a range from 60 to 100, (3-10) 104 Pa ,2 s to 10 s shipping, for the second parts mounted is from about 150 to about 200,(20~40) 104 Pa ,10 s to 20 s) conductive particles insulating film rupture, and squeeze the parts with lines (because the parts with relatively wireless roads protrude) together to form conduction, the volume of the extruded conductive particle is 3~4 times of the original volume (the volume of the conductive particle remains unchanged, the difference is that it is originally spherical, and after hot pressing, it becomes like a round cake, let the upper and lower electrodes have more area to contact with conductive particles), heat to solidify the adhesive and maintain the conduction state. Generally, the resistance of the conduction part is below 10, and the adjacent terminals of the non-conduction part are above 100 m.