DOW Corning DC184 500G 1.1KG 55G Superior Release Agent for Molding Lubrication Equipment Protection and Anti Stick Solutions

Product Overview

DOW Corning DC 184

<p><strong>DOW Corning DC 184</strong> is a two-component, transparent silicone encapsulant supplied in convenient kit form (typically 500 g or 1.1 kg). When the base and curing agent are mixed, it cures into a flexible, clear elastomer suitable for protecting delicate electronic assemblies and components. It is designed for both room-temperature and heat-accelerated curing, offering excellent processing flexibility for manufacturing environments.</p>

<h2>Key Features & Benefits</h2>
<ul>
<li>Transparent, low-stress elastomer with excellent optical clarity, allowing visual inspection of encapsulated parts.</li>
<li>Dual curing modes (ambient cure or heat acceleration) for optimized production cycles.</li>
<li>Minimal shrinkage and no exotherm during cure, reducing stress on sensitive components.</li>
<li>Outstanding dielectric insulation and moisture resistance.</li>
<li>Wide operating temperature range for reliable performance from <strong>–45 °C to 200 °C</strong>.</li>
<li>Compatible with standard electronic packaging, potting, and repair techniques.</li>
<li><strong>Complies with RoHS and REACH; solvent-free and non-corrosive formulation.</strong></li>
</ul>

<h2>Technical Specifications</h2>
<p><em>Note: Typical values only; not for specification purposes.</em></p>
<table border="1" cellspacing="0" cellpadding="6" style="width:100%;border-collapse:collapse;">
<tr><th>Parameter</th><th>Value / Unit</th></tr>
<tr><td>Color / Appearance</td><td>Colorless, transparent liquid (before cure)</td></tr>
<tr><td>Mix Ratio (Base : Curing Agent)</td><td>10 : 1 (by weight)</td></tr>
<tr><td>Viscosity (Base)</td><td>~ 5,100 cP (≈ 5.1 Pa·s)</td></tr>
<tr><td>Viscosity (Mixed)</td><td>~ 3,500 cP (≈ 3.5 Pa·s)</td></tr>
<tr><td>Pot Life (25 °C)</td><td>~ 1.5 hours</td></tr>
<tr><td>Room-Temperature Cure</td><td>~ 48 hours @ 25 °C</td></tr>
<tr><td>Heat Cure</td><td>35 min @ 100 °C / 20 min @ 125 °C / 10 min @ 150 °C</td></tr>
<tr><td>Durometer (Shore A)</td><td>~ 43</td></tr>
<tr><td>Tensile Strength</td><td>~ 980 psi (≈ 6.7 MPa)</td></tr>
<tr><td>Elongation at Break</td><td>~ 120 %</td></tr>
<tr><td>Dielectric Strength</td><td>~ 500 V/mil (≈ 19 kV/mm)</td></tr>
<tr><td>Volume Resistivity</td><td>~ 2.9 × 10¹⁴ Ω·cm</td></tr>
<tr><td>Dielectric Constant</td><td>2.72 (100 Hz) → 2.68 (100 kHz)</td></tr>
<tr><td>Dissipation Factor</td><td>0.00257 (100 Hz) → 0.00133 (100 kHz)</td></tr>
<tr><td>Thermal Conductivity</td><td>~ 0.27 W/(m·K)</td></tr>
<tr><td>Linear CTE</td><td>~ 340 ppm/°C</td></tr>
<tr><td>Operating Temperature Range</td><td>–45 °C to 200 °C</td></tr>
<tr><td>Shelf Life</td><td>24 months (sealed container)</td></tr>
</table>

<h2>Typical Applications</h2>
<ul>
<li>Encapsulation of LED modules and drivers</li>
<li>Potting of power supplies, sensors, and transformers</li>
<li>Encapsulation of connectors, relays, and amplifier circuits</li>
<li>Protective encapsulant for solar cells and beam-lead ICs</li>
<li>Circuit protection in instrumentation and control systems</li>
</ul>

<h2>Processing & Curing Instructions</h2>
<ol>
<li><strong>Mixing:</strong> Combine base and curing agent in a 10:1 weight ratio. Mix thoroughly without introducing air.</li>
<li><strong>De-Airing:</strong> For air-sensitive applications, degas under mild vacuum before pouring.</li>
<li><strong>Dispensing:</strong> Pour or dispense into the mold or housing. Vacuum-assisted filling may be used to avoid trapped air.</li>
<li><strong>Curing:</strong> Cure at ambient temperature (~48 h) or accelerate with heat (see schedule above).</li>
<li><strong>Post Cure:</strong> Not required; full properties achieved after primary cure.</li>
</ol>

<h2>Substrate Preparation & Adhesion</h2>
<ul>
<li>Clean and degrease all surfaces before applying encapsulant.</li>
<li>Apply a suitable primer (thin, uniform layer) if strong adhesion is required.</li>
<li>Allow primer to dry fully before encapsulant application.</li>
</ul>

<h2>Repairability & Rework</h2>
<p>DC 184 can be mechanically cut or peeled for access to components, allowing rework and repair. After removal, clean and roughen surfaces before reapplying new encapsulant for best adhesion.</p>

<h2>Storage & Handling</h2>
<ul>
<li>Store in a cool, dry place (≤ 25 °C) away from moisture.</li>
<li>Keep containers tightly sealed; minimize air exposure or purge with dry gas.</li>
<li>Avoid prolonged exposure to humidity, which may cause bubbles or curing defects.</li>
<li>Refer to the <strong>Safety Data Sheet (SDS)</strong> for handling, safety, and disposal guidelines.</li>
</ul>

<h2>Packaging Information</h2>
<ul>
<li>Standard package sizes: <strong>500 g kit</strong> and <strong>1.1 kg kit</strong> (Base + Curing Agent).</li>
<li>Larger industrial packs available upon request.</li>
<li>Shipped in sealed, moisture-protected containers to ensure product integrity.</li>
</ul>

<h2>Brand Assurance</h2>
<p><strong>DOW Corning</strong>, a globally recognized leader in silicone materials, guarantees consistent quality, performance, and reliability across all encapsulation and potting products. DC 184 is backed by <strong>Dow’s decades of experience</strong> in electronic-grade silicones, ensuring dependable protection for your most critical assemblies.</p>

<p><em>Note: Data are typical values and not intended for specification purposes. Always conduct application-specific testing prior to use.</em></p>