Sn64.7Bi35Ag0.3 Lead Free Solder Paste Syringe No-Clean Soldering Paste for SMT PCB BGA Repair Low Temperature Welding Flux

Description

Low Temperture: 138℃-151℃

1.No Clean Flux With Excellent Fluidity, Lead-Free, Non-Corrosive, In Compliance With RoHS Standards.The paste is gray in color with moderate viscosity and cures quickly after welding to form a protective film.Sn64.7Bi35Ag0.3 Flux Is Suitable For Household Appliance Repair Soldering

2.The Plunger Design Allows For Precise Control Of Flux Release, Smooth Flow, And Minimal Waste During The Soldering Process

3.The Flux Is Primarily Composed Of High-Concentration Rosin, Effortlessly Removing Surface Oxidation, Ensuring Stability And Reliability Of Solder Joints, And Enhancing Soldering Quality

4. The Flux Exhibits Outstanding Performance Under High-Temperature Conditions, Maintaining Stability And Resistance To Decomposition. This Means It Can Uphold Its Performance During High-Temperature Soldering Processes, Ensuring The Quality And Reliability Of Solder Joints.

Product name: Sn64.7Bi35Ag0.3

CAS NO.                                                                 Concentration％          

Sn:                                                                               59.6%

Bi:                                                                               29.2%

Rosin:                                                                           8.2%

2-Ethyl-1,3-hexanediol:                                              0.9%

Ethylene glycol monohexyl ether:                              2.1%