DIYPHONE BGA Reballing Stencil Kit For iPhone 17 16 15 14 13 13mini 11 12 Pro Max Black Steel CPU IC Chip Tin Soldering Net

Multi-purpose Black BGA Reballing Stencil Kit For iPhone 17 16 15 14 13 11 12 Pro MAX XS XR X 8P 8 7P 7 6S 6 Black Steel CPU IC Chip Tin Soldering Net

Description:

High Quality Stainless Steel Reballing Stencil.

Specially Designed for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR/11/11Pro/11Pro Max/12/13/14/15 /16 Series.

Make your repair work easier.

Color : Black

Feature : Square Hole --We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.

Lanrui P08 Explosion-proof Solder Gasket made of high-temperature resistant ultra-white glass can easily tin-plate mobile phone CPU chips without splattering.

Description:

Lanrui P08 explosion-proof solder gasket effectively prevents uneven solder balls or solder bursting caused by pad oxidation, stencil protrusion, etc., offering strong impact resistance and stability, providing safety protection during the soldering process, and improving mobile phone repair efficiency. Suitable for electronic repair and mobile phone motherboard soldering.

Features:

1. Explosion-proof design: Prevents solder balls from bursting due to stencil bulging, improving soldering safety.

2. Smoother soldering: Reduces splatter and uneven solder points, increasing soldering success rate.

3. Ultra-white glass material: High temperature resistant, impact resistant, durable, and not easily deformed.

4. Effectively solves oxidation problems: Facilitates smooth soldering even with oxidized pads.

5. Compact and lightweight: 20×20mm size, suitable for various soldering scenarios.